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Products
    Tantalum Sputtering Target - Customized
    Standard:
    ASTM B708
    Grade:
    RO6200, Ta 99.95%-99.99%
    Size:
    Disc Target, Rectangular Target , Rotary target

    Introduction:

    Application:

    Coating materials for semiconductors and optics

    Purity:99.95%(3N5) - 99.99%(4N)

    Dimension:disc target, rectangular target and rotary target

    Manufacturing Standard: ASTM B 708


    Specifications:

    Typical Analysis: 99.95(3N5) - 99.99%(4N)

    Metallic impurities, ppm max by weight

    Balance: Tantalum

    Element

    Al

    Ag

    Au

    B

    Bi

    Ca

    Cd

    Cl

    Co

    Cr

    Cu

    Fe

    Content

    0.2

    1.0

    1.0

    0.1

    1.0

    0.1

    1.0

    1.0

    0.05

    0.25

    0.75

    0.4

    Element

    Ga

    Ge

    Hf

    K

    Li

    Mg

    Mn

    Mo

    Na

    Nb

    Ni

    P

    Content

    1.0

    1.0

    1.0

    0.05

    0.1

    0.1

    0.1

    5.0

    0.1

    75

    0.25

    1.0

    Element

    Pb

    S

    Si

    Sn

    Th

    Ti

    V

    W

    Zn

    Zr

    Y

    U

    Content

    1.0

    0.2

    0.2

    0.1

    0.0

    1.0

    0.2

    70.0

    1.0

    0.2

    1.0

    0.005

    Non-Metallic impurities, ppm max by weight

    Element

    C

    H

    O

    N

    Content

    100

    15

    150

    100


          

      Grain Size:

      Typical size<100μm Grain Size

      Other grain size available upon request

      Flatness ≤0.2mm

      Surface Roughness<1.6μm


    Products

    RegularSpecification

    LimitSpecification

    Tantalum target

    1193*127*6.0mm 685.8*127*6.35mm 320*100*8mm 377.8*120.6*6.35mm 475*127*6.0mm Φ355.6*6mm Φ101*6.0mm Φ152.4*6.0mm

    The maximum length of one planar target is 1550mm,the maximum width is 530mm,grain size can be controlled between 30 to 80μm.


    For more enquiries for customization, please don't hesitate to contact us.