Tantalum Sputtering Target - Customized

[ Posttime:2018-07-04 | Hits:1589 ]

Application:

Coating materials for semiconductors and optics

Purity:99.95%(3N5) - 99.99%(4N)

Dimension:disc target, rectangular target and rotary target

Manufacturing Standard: ASTM B 708


Specifications:

Typical Analysis: 99.95(3N5) - 99.99%(4N)

Metallic impurities, ppm max by weight

Balance: Tantalum

Element

Al

Ag

Au

B

Bi

Ca

Cd

Cl

Co

Cr

Cu

Fe

Content

0.2

1.0

1.0

0.1

1.0

0.1

1.0

1.0

0.05

0.25

0.75

0.4

Element

Ga

Ge

Hf

K

Li

Mg

Mn

Mo

Na

Nb

Ni

P

Content

1.0

1.0

1.0

0.05

0.1

0.1

0.1

5.0

0.1

75

0.25

1.0

Element

Pb

S

Si

Sn

Th

Ti

V

W

Zn

Zr

Y

U

Content

1.0

0.2

0.2

0.1

0.0

1.0

0.2

70.0

1.0

0.2

1.0

0.005

Non-Metallic impurities, ppm max by weight

Element

C

H

O

N

Content

100

15

150

100


      

  Grain Size:

  Typical size<100μm Grain Size

  Other grain size available upon request

  Flatness ≤0.2mm

  Surface Roughness<1.6μm


Products

RegularSpecification

LimitSpecification

Tantalum target

1193*127*6.0mm 685.8*127*6.35mm 320*100*8mm 377.8*120.6*6.35mm 475*127*6.0mm Φ355.6*6mm Φ101*6.0mm Φ152.4*6.0mm

The maximum length of one planar target is 1550mm,the maximum width is 530mm,grain size can be controlled between 30 to 80μm.


For more enquiries for customization, please don't hesitate to contact us.